Advanced Ceramics for Semiconductor Manufacturing,Precision Ceramic Components for Semiconductor Equipment,Semiconductor-Grade Ceramic Solutions

Advanced ceramics, with their excellent properties such as high temperature resistance, insulation, and low expansion, play a crucial role in semiconductor manufacturing, safeguarding the stability of performance from equipment chambers to chip packaging.

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Semiconductor 2.0 Era: The Reliability Revolution of Advanced Ceramics

Advanced ceramics, due to their exceptional high-temperature stability, low thermal expansion coefficient, high hardness and resistance to plasma corrosion, have become the core material for semiconductor manufacturing. Their high cleanliness, wear resistance and low particle contamination characteristics provide crucial support for processes such as wafer processing and packaging testing, facilitating the advancement of chip manufacturing towards precision and efficiency.

Wafer processing equipment

E tching chamber/focusing ring: Nitride silicon and alumina ceramics resist plasma erosion, enhancing the uniformity of etching and the stability of the equipment.
Wafer carrier disc: Low thermal expansion ensures the flatness of the wafer during high-temperature processes, suitable for key procedures such as lithography and diffusion.
CMP rollers: High hardness reduces scratches on the wafer surface, improving polishing accuracy.

Packaging and Testing

Ceramic substrates: Alumina and AlN-based substrates have high thermal conductivity and insulation properties, suitable for power semiconductor (IGBT, MOSFET) packaging, enhancing heat dissipation efficiency.Test probe card: Ceramic materials have high rigidity and low deformation, ensuring the stability of high-frequency signal testing.Optical components: High-purity yttria and calcium fluoride ceramics are used in the optical system of EUV lithography machines, resistant to laser damage and with high light transmittance.

Advanced process support

EUV mask substrate: Low thermal expansion ceramics (such as zirconia reinforced alumina) reduce photolithography pattern offset and support nanoscale manufacturing processes.
ALD reactor chamber: Ceramic inner walls resist chemical corrosion, ensuring uniform film deposition, suitable for logic chips and memory manufacturing.
HTCC packaging: Multi-layer ceramic substrates achieve high-density interconnection, suitable for high-frequency modules such as 5G and automotive electronics.

Our product display

Full Ceramic Bearing | Zirconia / Silicon Nitride / Alumina Ceramic Bearings

High Precision Industrial Ceramic Balls (Alumina / Zirconia / Si3N4 / SiC)

Zirconia Ceramic Metering Pump Wear-Resistant Rotating Piston Sleeve

Zirconia Ceramic Valve Core and Sleeve for Pharmaceutical Metering Pumps

95% Alumina (Al_2O_3) Ceramic Valve Disc for Faucets

95%/99% Alumina Ceramic Insulator for Type K Thermocouple

High-Strength Silicon Nitride ($Si_3N_4$) Insulating Locating Pin / Core

High-Precision Zirconia (ZrO_2) Fiber Optic Ceramic Ferrule

99% High-Purity Alumina Thermocouple Insulator (Multi-bore)

99% High-Purity Alumina Insulating Ceramic Sleeve

Ultra-High Purity Semiconductor Ceramic Sleeve

High-Precision Single Crystal Alumina (Sapphire) Sleeve

Precision Zirconia (ZrO_2) Hollow Sleeve / Bushing

High-Performance Silicon Carbide (SiC) Ceramic Sleeve

Wear-Resistant & High-Insulation Alumina Ceramic Sleeve

Precision Alumina (Al_2O_3) Ceramic Sleeve / Bushing

Precision Alumina Ceramic Shaft Plug & Sleeve Set

High-Purity Hexagonal Boron Nitride (BN) Ceramic Rod

Precision Alumina Ceramic Piston Rod

High-Pressure Pump Ceramic Piston (Plunger)

Customizable

We have a wide range of technologies such as material technology, process technology, design technology, measurement/evaluation technology, and integrated processes from materials to products in-house, so we can respond to various customizations. Please feel free to contact us first.

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Ceramics Materials: Alumina Ceramics; Zirconia Ceramics; Beryllium Oxide Ceramic; Aluminium Nitride Ceramics; Silicon Nitride Ceramics; Boron Nitride Ceramic; Silicon Carbide Ceramics; Boron Carbide Ceramics

Capabilities: Raw Material Preparation; Molding; Sintering; Machining and Surface Treatment; Testing Capability

Contact Us: Room 101, Building 2, No. 2, Kelian Road, Tangxia Town, Dongguan City, Guangdong Province; postmaster@cerampro.com; 13652526615

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